Kjøpe SBSMC5000103MXT med BYCHPS
Kjøp med garanti
SBSMC5000103MXT
- Delenummer:
- SBSMC5000103MXT
- Produsent:
- Knowles / Syfer
- Beskrivelse:
- CAP FEEDTHRU 0.01UF 500V 2220
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 15460 Pieces
- Dataark:
- SBSMC5000103MXT.pdf
Introduksjon
BYCHIPS er strømprodusenten for SBSMC5000103MXT, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for SBSMC5000103MXT via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 500V |
|---|---|
| Toleranse: | ±20% |
| Temperaturkoeffisient: | X7R |
| Størrelse / Dimensjon: | 0.224" L x 0.197" W (5.70mm x 5.00mm) |
| Serie: | SBSM |
| rangeringer: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 2220 (5750 Metric), 3 PC Pad |
| Andre navn: | 1608-1197-2 |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 11 Weeks |
| Produsentens varenummer: | SBSMC5000103MXT |
| Innsettingstap: | 50dB @ 100MHz |
| Høyde (maks): | 0.133" (3.38mm) |
| Utvidet beskrivelse: | 10000pF Feed Through Capacitor 500V 20A 2220 (5750 Metric), 3 PC Pad |
| Beskrivelse: | CAP FEEDTHRU 0.01UF 500V 2220 |
| DC-motstand (DCR) (maks): | - |
| Nåværende: | 20A |
| kapasitans: | 10000pF |
| Email: | [email protected] |
Beslektede deler til SBSMC5000103MXT
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
SBSMC5000683MXT | Knowles Syfer | CAP FEEDTHRU 0.068UF 500V 2220 | Forespørsel |
 |
FN7561-30-M6S | Schaffner EMC Inc. | CAP FEEDTHRU 650V AXIAL | Forespørsel |
|
SBSMC1000334MXT | Knowles Syfer | CAP FEEDTHRU 0.33UF 100V 2220 | Forespørsel |
 |
PSM4-152M-10T2 | API Technologies Corp | CAP FEEDTHRU 1500PF 200V 3PSM | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers