Kjøpe SE12DDHM3/I med BYCHPS
Kjøp med garanti
SE12DDHM3/I
- Delenummer:
- SE12DDHM3/I
- Produsent:
- Vishay / Semiconductor - Diodes Division
- Beskrivelse:
- DIODE GEN PURP 200V 3.2A TO263AC
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15889 Pieces
- Dataark:
- SE12DDHM3/I.pdf
Introduksjon
BYCHIPS er strømprodusenten for SE12DDHM3/I, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for SE12DDHM3/I via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Videresend (Vf) (Maks) @ Hvis: | 1.15V @ 12A |
|---|---|
| Spenning - DC-omvendt (Vr) (Maks): | 200V |
| Leverandør Enhetspakke: | TO-263AC (SMPD) |
| Hastighet: | Standard Recovery >500ns, > 200mA (Io) |
| Serie: | Automotive, AEC-Q101, eSMP® |
| Omvendt gjenopprettingstid (trr): | 3µs |
| emballasje: | Original-Reel® |
| Pakke / tilfelle: | TO-263-3, D²Pak (2 Leads + Tab) Variant |
| Andre navn: | SE12DDHM3/IGIDKR |
| Driftstemperatur - Kobling: | -55°C ~ 175°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 16 Weeks |
| Produsentens varenummer: | SE12DDHM3/I |
| Utvidet beskrivelse: | Diode Standard 200V 3.2A Surface Mount TO-263AC (SMPD) |
| Diodetype: | Standard |
| Beskrivelse: | DIODE GEN PURP 200V 3.2A TO263AC |
| Strøm - Omvendt lekkasje @ Vr: | 20µA @ 200V |
| Gjeldende - Gjennomsnittlig Rectified (Io): | 3.2A |
| Kapasitans @ Vr, F: | 90pF @ 4V, 1MHz |
| Email: | [email protected] |
Beslektede deler til SE12DDHM3/I
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers