Kjøpe SY58606UMG med BYCHPS
Kjøp med garanti
SY58606UMG
- Delenummer:
- SY58606UMG
- Produsent:
- Micrel / Microchip Technology
- Beskrivelse:
- IC CLK BUFFER 1:2 3GHZ 16MLF
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16447 Pieces
- Dataark:
- SY58606UMG.pdf
Introduksjon
BYCHIPS er strømprodusenten for SY58606UMG, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for SY58606UMG via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 2.375 V ~ 3.6 V |
|---|---|
| Type: | Fanout Buffer (Distribution) |
| Leverandør Enhetspakke: | 16-MLF® (3x3) |
| Serie: | Precision Edge® |
| Forhold - Input: Output: | 1:2 |
| emballasje: | Tray |
| Pakke / tilfelle: | 16-VFQFN Exposed Pad, 16-MLF® |
| Produksjon: | CML |
| Andre navn: | 576-1597 |
| Driftstemperatur: | -40°C ~ 85°C |
| Antall kretser: | 1 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 2 (1 Year) |
| Produsentens Standard Lead Time: | 12 Weeks |
| Produsentens varenummer: | SY58606UMG |
| Input: | CML, LVDS, LVPECL |
| Frekvens - Maks: | 3GHz |
| Utvidet beskrivelse: | Clock Fanout Buffer (Distribution) IC 3GHz 16-VFQFN Exposed Pad, 16-MLF® |
| Differensial - Input: Output: | Yes/Yes |
| Beskrivelse: | IC CLK BUFFER 1:2 3GHZ 16MLF |
| Email: | [email protected] |
Beslektede deler til SY58606UMG
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers