Kjøpe T90S1D12-18 med BYCHPS
Kjøp med garanti
T90S1D12-18
- Delenummer:
- T90S1D12-18
- Beskrivelse:
- RELAY GEN PURPOSE SPST 30A 18V
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS-kompatibel
- Tilgjengelig mengde:
- 18234 Pieces
- Dataark:
- T90S1D12-18.pdf
Introduksjon
BYCHIPS er strømprodusenten for T90S1D12-18, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for T90S1D12-18 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Slå på spenning (maks): | 13.5 VDC |
|---|---|
| Slå av spenning (Min): | 1.8 VDC |
| Oppsigelsesstil: | PC Pin |
| Bryter spenning: | 240VAC, 28VDC - Max |
| Serie: | T90 |
| Frigjør tid: | 15ms |
| Relé Type: | General Purpose |
| emballasje: | Bulk |
| Andre navn: | 1-1393209-3 1-1393209-3-ND 113932093 PB1411 T90S1D12-18-ND |
| Driftstemperatur: | -55°C ~ 85°C |
| Bruk tid: | 15ms |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 14 Weeks |
| Produsentens varenummer: | T90S1D12-18 |
| Egenskaper: | Insulation - Class F, Sealed - Fully |
| Utvidet beskrivelse: | General Purpose Relay SPST-NO (1 Form A) 18VDC Coil Through Hole |
| Beskrivelse: | RELAY GEN PURPOSE SPST 30A 18V |
| Kontakt Rating (Nåværende): | 30A |
| Kontaktmateriale: | Silver Cadmium Oxide (AgCdO) |
| Kontakt skjema: | SPST-NO (1 Form A) |
| Spolespenning: | 18VDC |
| Spole type: | Non Latching |
| Coil Resistance: | 380 Ohms |
| Coil Power: | 900 mW |
| Coil Current: | 47mA |
| Email: | [email protected] |
Beslektede deler til T90S1D12-18
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers