Kjøpe T9AP1D52-36-01 med BYCHPS
Kjøp med garanti
T9AP1D52-36-01
- Delenummer:
- T9AP1D52-36-01
- Beskrivelse:
- RELAY GEN PURPOSE SPST 30A 36V
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS-kompatibel
- Tilgjengelig mengde:
- 19280 Pieces
- Dataark:
- T9AP1D52-36-01.pdf
Introduksjon
BYCHIPS er strømprodusenten for T9AP1D52-36-01, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for T9AP1D52-36-01 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Slå på spenning (maks): | 27 VDC |
|---|---|
| Slå av spenning (Min): | 3.6 VDC |
| Oppsigelsesstil: | Quick Connect - 0.187"/0.250" |
| Bryter spenning: | 277VAC - Max |
| Serie: | T9A |
| Frigjør tid: | 15ms |
| Relé Type: | General Purpose |
| emballasje: | Bulk |
| Andre navn: | 5-1419102-9 T9AP1D523601 |
| Driftstemperatur: | -55°C ~ 85°C |
| Bruk tid: | 15ms |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 17 Weeks |
| Produsentens varenummer: | T9AP1D52-36-01 |
| Egenskaper: | Insulation - Class F |
| Utvidet beskrivelse: | General Purpose Relay SPST-NO (1 Form A) 36VDC Coil Chassis Mount |
| Beskrivelse: | RELAY GEN PURPOSE SPST 30A 36V |
| Kontakt Rating (Nåværende): | 30A |
| Kontaktmateriale: | Silver Cadmium Oxide (AgCdO) |
| Kontakt skjema: | SPST-NO (1 Form A) |
| Spolespenning: | 36VDC |
| Spole type: | Non Latching |
| Coil Resistance: | 1.3 kOhms |
| Coil Power: | 1 W |
| Coil Current: | 27.8mA |
| Email: | [email protected] |
Beslektede deler til T9AP1D52-36-01
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers