Kjøpe TDZ30090BH10138BG1 med BYCHPS
Kjøp med garanti
TDZ30090BH10138BG1
- Delenummer:
- TDZ30090BH10138BG1
- Produsent:
- Draloric / Vishay
- Beskrivelse:
- CAP CER 100PF 10KV R16
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 16908 Pieces
- Dataark:
- TDZ30090BH10138BG1.pdf
Introduksjon
BYCHIPS er strømprodusenten for TDZ30090BH10138BG1, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for TDZ30090BH10138BG1 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 10000V (10kV) |
|---|---|
| Toleranse: | ±20% |
| Tykkelse (Maks): | - |
| Temperaturkoeffisient: | R16 |
| Størrelse / Dimensjon: | - |
| Serie: | - |
| rangeringer: | - |
| emballasje: | - |
| Pakke / tilfelle: | - |
| Driftstemperatur: | - |
| Monteringstype: | - |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 20 Weeks |
| Produsentens varenummer: | TDZ30090BH10138BG1 |
| Lead Style: | - |
| Lead Spacing: | - |
| Høyde - sittende (maks): | - |
| Egenskaper: | High Voltage |
| Utvidet beskrivelse: | 100pF ±20% 10000V (10kV) Ceramic Capacitor R16 |
| Beskrivelse: | CAP CER 100PF 10KV R16 |
| kapasitans: | 100pF |
| applikasjoner: | General Purpose |
| Email: | [email protected] |
Beslektede deler til TDZ30090BH10138BG1
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
TDZ30090BH10238BJ1 | Vishay Beyschlag | CAP CER 1000PF 10KV R85 | Forespørsel |
|
TDZ30090BH16138BG1 | Vishay Beyschlag | CAP CER 160PF 10KV R16 | Forespørsel |
|
TDZ30090WC12238BJ1 | Vishay Beyschlag | CAP CER 1200PF 9KV R85 | Forespørsel |
|
TDZ30090BH12138BG1 | Vishay Beyschlag | CAP CER 120PF 10KV R16 | Forespørsel |
|
TDZ30090BH50138BJ1 | Vishay Beyschlag | CAP CER 500PF 10KV R85 | Forespørsel |
|
TDZ30055BH50138BJ1 | Vishay Beyschlag | CAP CER 500PF 10KV R85 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers