Kjøpe VLS3012ET-6R8M med BYCHPS
Kjøp med garanti
VLS3012ET-6R8M
- Delenummer:
- VLS3012ET-6R8M
- Produsent:
- TDK Corporation
- Beskrivelse:
- FIXED IND 6.8UH 810MA 228 MOHM
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18155 Pieces
- Dataark:
- VLS3012ET-6R8M.pdf
Introduksjon
BYCHIPS er strømprodusenten for VLS3012ET-6R8M, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for VLS3012ET-6R8M via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Wirewound |
|---|---|
| Toleranse: | ±20% |
| Leverandør Enhetspakke: | - |
| Størrelse / Dimensjon: | 0.118" L x 0.118" W (3.00mm x 3.00mm) |
| skjerming: | Shielded |
| Serie: | VLS |
| rangeringer: | - |
| Q @ Freq: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | Nonstandard |
| Andre navn: | 445-6669-2 VLS3012ET6R8M |
| Driftstemperatur: | -40°C ~ 105°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale - Kjerne: | Ferrite |
| Produsentens Standard Lead Time: | 12 Weeks |
| Produsentens varenummer: | VLS3012ET-6R8M |
| induktans: | 6.8µH |
| Høyde - sittende (maks): | 0.047" (1.20mm) |
| Frekvens - Test: | 1MHz |
| Frekvens - Selvresonans: | - |
| Utvidet beskrivelse: | 6.8µH Shielded Wirewound Inductor 810mA 228 mOhm Max Nonstandard |
| Beskrivelse: | FIXED IND 6.8UH 810MA 228 MOHM |
| DC-motstand (DCR): | 228 mOhm Max |
| Nåværende vurdering: | 810mA |
| Nåværende - Metning: | 810mA |
| Email: | [email protected] |
Beslektede deler til VLS3012ET-6R8M
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers