Kjøpe XCZU5CG-1SFVC784E med BYCHPS
Kjøp med garanti
XCZU5CG-1SFVC784E
- Delenummer:
- XCZU5CG-1SFVC784E
- Produsent:
- Xilinx
- Beskrivelse:
- IC FPGA 252 I/O 784FCBGA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19617 Pieces
- Dataark:
- XCZU5CG-1SFVC784E.pdf
Introduksjon
BYCHIPS er strømprodusenten for XCZU5CG-1SFVC784E, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for XCZU5CG-1SFVC784E via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Leverandør Enhetspakke: | 784-FCBGA (23x23) |
|---|---|
| Hastighet: | 533MHz, 1.3GHz |
| Serie: | Zynq® UltraScale+™ MPSoC CG |
| Primæregenskaper: | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells |
| periferi~~POS=TRUNC: | DMA, WDT |
| emballasje: | Tray |
| Pakke / tilfelle: | 784-BBGA, FCBGA |
| Driftstemperatur: | 0°C ~ 100°C (TJ) |
| Antall I / O: | 252 |
| Vannfølsomhetsnivå (MSL): | 4 (72 Hours) |
| Produsentens varenummer: | XCZU5CG-1SFVC784E |
| MCU RAM: | 256KB |
| MCU Flash: | - |
| Utvidet beskrivelse: | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 256K+ Logic Cells 256KB 533MHz, 1.3GHz 784-FCBGA (23x23) |
| Beskrivelse: | IC FPGA 252 I/O 784FCBGA |
| Kjerneprosessor: | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| tilkobling: | CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Arkitektur: | MCU, FPGA |
| Email: | [email protected] |
Beslektede deler til XCZU5CG-1SFVC784E
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers