Kjøpe 100LSQ27000M64X99 med BYCHPS
Kjøp med garanti
100LSQ27000M64X99
- Delenummer:
- 100LSQ27000M64X99
- Produsent:
- Rubycon
- Beskrivelse:
- SCREW TERMINAL
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14565 Pieces
Introduksjon
BYCHIPS er strømprodusenten for 100LSQ27000M64X99, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 100LSQ27000M64X99 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | * |
|---|---|
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 16 Weeks |
| Produsentens varenummer: | 100LSQ27000M64X99 |
| Utvidet beskrivelse: | Aluminum Capacitors |
| Beskrivelse: | SCREW TERMINAL |
| Email: | [email protected] |
Beslektede deler til 100LSQ27000M64X99
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
100LSQ2200M36X50 | Rubycon | SCREW TERMINAL | Forespørsel |
 |
100LSQ27000MEFC64X99 | Rubycon | CAP ALUM 27000UF 20% 100V SCREW | Forespørsel |
 |
100LSQ22000MEFC51X118 | Rubycon | CAP ALUM 22000UF 20% 100V SCREW | Forespørsel |
 |
100LSQ2200MEFC36X50 | Rubycon | CAP ALUM 2200UF 20% 100V SCREW | Forespørsel |
|
100LSQ18000M51X98 | Rubycon | SCREW TERMINAL | Forespørsel |
 |
100LSQ15000MEFC51X83 | Rubycon | CAP ALUM 15000UF 20% 100V SCREW | Forespørsel |
|
100LSQ15000M51X83 | Rubycon | SCREW TERMINAL | Forespørsel |
|
100LSQ22000MNB51X118 | Rubycon | CAP ALUM 22000UF 20% 100V SCREW | Forespørsel |
|
100LSQ100000M90X141 | Rubycon | SCREW TERMINAL | Forespørsel |
 |
100LSQ4700MNB36X83 | Rubycon | CAP ALUM 4700UF 20% 100V SCREW | Forespørsel |
 |
100LSQ82000MEFC90X141 | Rubycon | CAP ALUM 82000UF 20% 100V SCREW | Forespørsel |
|
100LSQ4700MEFC36X83 | Rubycon | SCREW TERMINAL | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers