Kjøpe 16SEP39M+TSS med BYCHPS
Kjøp med garanti
16SEP39M+TSS
- Delenummer:
- 16SEP39M+TSS
- Produsent:
- Panasonic
- Beskrivelse:
- CAP ALUM POLY 39UF 20% 16V T/H
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18252 Pieces
- Dataark:
- 16SEP39M+TSS.pdf
Introduksjon
BYCHIPS er strømprodusenten for 16SEP39M+TSS, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 16SEP39M+TSS via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier: | 16V |
|---|---|
| Type: | Polymer |
| Toleranse: | ±20% |
| Surface Mount Land Size: | - |
| Størrelse / Dimensjon: | 0.248" Dia (6.30mm) |
| Serie: | OS-CON™, SEP |
| Ripple Current - Lavfrekvens: | 81mA @ 120Hz |
| Ripple Current - High Frequency: | 1.62A @ 100kHz |
| emballasje: | Cut Tape (CT) |
| Pakke / tilfelle: | Radial, Can |
| Andre navn: | P16376CT |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 8 Weeks |
| Produsentens varenummer: | 16SEP39M+TSS |
| Levetid @ Temp.: | 3000 Hrs @ 105°C |
| Lead Spacing: | 0.098" (2.50mm) |
| impedans: | - |
| Høyde - sittende (maks): | 0.236" (6.00mm) |
| Utvidet beskrivelse: | 39µF ±20% 16V Aluminum Polymer Capacitor Radial, Can 50 mOhm 3000 Hrs @ 105°C |
| ESR (ekvivalent serieresistens): | 50 mOhm |
| Beskrivelse: | CAP ALUM POLY 39UF 20% 16V T/H |
| kapasitans: | 39µF |
| applikasjoner: | General Purpose |
| Email: | [email protected] |
Beslektede deler til 16SEP39M+TSS
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers