Kjøpe 450MXG180MEFC25X30 med BYCHPS
Kjøp med garanti
450MXG180MEFC25X30
- Delenummer:
- 450MXG180MEFC25X30
- Produsent:
- Rubycon
- Beskrivelse:
- SNAP TERMINAL
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 15080 Pieces
Introduksjon
BYCHIPS er strømprodusenten for 450MXG180MEFC25X30, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 450MXG180MEFC25X30 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | * |
|---|---|
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 16 Weeks |
| Produsentens varenummer: | 450MXG180MEFC25X30 |
| Utvidet beskrivelse: | Aluminum Capacitors |
| Beskrivelse: | SNAP TERMINAL |
| Email: | [email protected] |
Beslektede deler til 450MXG180MEFC25X30
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
450MXG180MEFC20X45 | Rubycon | SNAP TERMINAL | Forespørsel |
|
450MXG180MEFC25X35 | Rubycon | CAP ALUM 180UF 20% 450V SNAP | Forespørsel |
|
450MXG180MEFC22X40 | Rubycon | CAP ALUM 180UF 20% 450V SNAP | Forespørsel |
 |
450MXG180MEFCSN30X25 | Rubycon | CAP ALUM 180UF 20% 450V SNAP | Forespørsel |
|
450MXG180MEFC30X25 | Rubycon | CAP ALUM 180UF 20% 450V SNAP | Forespørsel |
 |
450MXG180MEFCSN22X40 | Rubycon | CAP ALUM 180UF 20% 450V SNAP | Forespørsel |
|
450MXG180MEFCSN25X35 | Rubycon | CAP ALUM 180UF 20% 450V SNAP | Forespørsel |
 |
450MXG180MEFCSN25X30 | Rubycon | CAP ALUM 180UF 20% 450V SNAP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog