Kjøpe 70F337AP med BYCHPS
Kjøp med garanti
70F337AP
- Delenummer:
- 70F337AP
- Produsent:
- Bourns, Inc.
- Beskrivelse:
- FIXED IND 330NH 1.69A 700 MOHM
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 14508 Pieces
- Dataark:
- 70F337AP.pdf
Introduksjon
BYCHIPS er strømprodusenten for 70F337AP, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 70F337AP via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Wirewound |
|---|---|
| Toleranse: | ±20% |
| Leverandør Enhetspakke: | Axial |
| Størrelse / Dimensjon: | 0.120" Dia x 0.310" L (3.05mm x 7.87mm) |
| skjerming: | Unshielded |
| Serie: | 70F |
| rangeringer: | - |
| Q @ Freq: | 47 @ 25MHz |
| emballasje: | Bulk |
| Pakke / tilfelle: | Axial |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale - Kjerne: | Phenolic |
| Produsentens varenummer: | 70F337AP |
| induktans: | 330nH |
| Høyde - sittende (maks): | - |
| Frekvens - Test: | 25MHz |
| Frekvens - Selvresonans: | 330MHz |
| Utvidet beskrivelse: | 330nH Unshielded Wirewound Inductor 1.69A 700 mOhm Max Axial |
| Beskrivelse: | FIXED IND 330NH 1.69A 700 MOHM |
| DC-motstand (DCR): | 700 mOhm Max |
| Nåværende vurdering: | 1.69A |
| Nåværende - Metning: | - |
| Email: | [email protected] |
Beslektede deler til 70F337AP
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
70F333AI | Bourns Inc. | FIXED IND 3.3MH 53MA 51.6 OHM TH | Forespørsel |
 |
70F331AF-RC | Bourns Inc. | FIXED IND 330MH 34MA 540 OHM TH | Forespørsel |
 |
PG0015.474NLT | Pulse Electronics Corporation | FIXED IND 470UH 420MA 1.48 OHM | Forespørsel |
 |
CM100505-3N3DL | Bourns Inc. | FIXED IND 3.3NH 400MA 120 MOHM | Forespørsel |
 |
70F335AI-RC | Bourns Inc. | FIXED IND 33UH 208MA 2.76 OHM TH | Forespørsel |
 |
LQW15CNR11J1ZD | Murata Electronics North America | FIXED IND 106NH 850MA 144 MOHM | Forespørsel |
 |
70F334AI-RC | Bourns Inc. | FIXED IND 330UH 103MA 13.9 OHM | Forespørsel |
 |
70F332AF | Bourns Inc. | FIXED IND 33MH 43MA 134 OHM TH | Forespørsel |
 |
70F333AI-RC | Bourns Inc. | FIXED IND 3.3MH 53MA 51.6 OHM TH | Forespørsel |
 |
70F337AP-RC | Bourns Inc. | FIXED IND 330NH 1.69A 700 MOHM | Forespørsel |
 |
ER1641-622JS | API Delevan Inc. | FIXED IND 6.2UH 280MA 1.02 OHM | Forespørsel |
|
70F335AI | Bourns Inc. | FIXED IND 33UH 208MA 2.76 OHM TH | Forespørsel |
|
0925-331K | API Delevan Inc. | FIXED IND 330NH 495MA 180 MOHM | Forespørsel |
|
70F334AI | Bourns Inc. | FIXED IND 330UH 103MA 13.9 OHM | Forespørsel |
|
70F332AF-RC | Bourns Inc. | FIXED IND 33MH 43MA 134 OHM TH | Forespørsel |
 |
70F336AI | Bourns Inc. | FIXED IND 3.3UH 912MA 240 MOHM | Forespørsel |
 |
ASPI-1306T-331M-T | Abracon LLC | FIXED IND 330UH 1A 560 MOHM SMD | Forespørsel |
|
70F336AI-RC | Bourns Inc. | FIXED IND 3.3UH 912MA 240 MOHM | Forespørsel |
|
70F331AF | Bourns Inc. | FIXED IND 330MH 34MA 540 OHM TH | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers