Kjøpe 74438333022 med BYCHPS
Kjøp med garanti
74438333022
- Delenummer:
- 74438333022
- Produsent:
- Wurth Electronics
- Beskrivelse:
- FIXED IND 2.2UH 1.4A 172 MOHM
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18861 Pieces
- Dataark:
- 74438333022.pdf
Introduksjon
BYCHIPS er strømprodusenten for 74438333022, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 74438333022 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Molded |
|---|---|
| Toleranse: | ±20% |
| Leverandør Enhetspakke: | 1212 (3030 Metric) |
| Størrelse / Dimensjon: | 0.118" L x 0.118" W (3.00mm x 3.00mm) |
| skjerming: | Shielded |
| Serie: | WE-MAPI |
| rangeringer: | - |
| Q @ Freq: | - |
| emballasje: | Original-Reel® |
| Pakke / tilfelle: | 1212 (3030 Metric) |
| Andre navn: | 732-4852-6 |
| Driftstemperatur: | -40°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale - Kjerne: | Metal Composite |
| Produsentens Standard Lead Time: | 10 Weeks |
| Produsentens varenummer: | 74438333022 |
| induktans: | 2.2µH |
| Høyde - sittende (maks): | 0.039" (1.00mm) |
| Frekvens - Test: | 100kHz |
| Frekvens - Selvresonans: | 50MHz |
| Utvidet beskrivelse: | 2.2µH Shielded Molded Inductor 1.4A 172 mOhm Max 1212 (3030 Metric) |
| Beskrivelse: | FIXED IND 2.2UH 1.4A 172 MOHM |
| DC-motstand (DCR): | 172 mOhm Max |
| Nåværende vurdering: | 1.4A |
| Nåværende - Metning: | 3.9A |
| Email: | [email protected] |
Beslektede deler til 74438333022
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers