Kjøpe 80MXG4700MEFCSN25X50 med BYCHPS
Kjøp med garanti
80MXG4700MEFCSN25X50
- Delenummer:
- 80MXG4700MEFCSN25X50
- Produsent:
- Rubycon
- Beskrivelse:
- CAP ALUM 4700UF 20% 80V SNAP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16719 Pieces
Introduksjon
BYCHIPS er strømprodusenten for 80MXG4700MEFCSN25X50, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 80MXG4700MEFCSN25X50 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier: | 80V |
|---|---|
| Toleranse: | ±20% |
| Surface Mount Land Size: | - |
| Størrelse / Dimensjon: | 0.984" Dia (25.00mm) |
| Serie: | MXG |
| Ripple Current: | 3.38A @ 120Hz |
| polarisering: | Polar |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can - Snap-In |
| Driftstemperatur: | -40°C ~ 105°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 16 Weeks |
| Produsentens varenummer: | 80MXG4700MEFCSN25X50 |
| Levetid @ Temp.: | 2000 Hrs @ 105°C |
| Lead Spacing: | 0.394" (10.00mm) |
| impedans: | - |
| Høyde - sittende (maks): | 2.047" (52.00mm) |
| Utvidet beskrivelse: | 4700µF 80V Aluminum Capacitors Radial, Can - Snap-In 2000 Hrs @ 105°C |
| ESR (ekvivalent serieresistens): | - |
| Beskrivelse: | CAP ALUM 4700UF 20% 80V SNAP |
| kapasitans: | 4700µF |
| applikasjoner: | General Purpose |
| Email: | [email protected] |
Beslektede deler til 80MXG4700MEFCSN25X50
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
80MXG4700MEFCSN35X30 | Rubycon | CAP ALUM 4700UF 20% 80V SNAP | Forespørsel |
 |
80MXG4700MEFC25X50 | Rubycon | CAP ALUM 4700UF 20% 80V SNAP | Forespørsel |
|
80MXG4700MEFC30X35 | Rubycon | CAP ALUM 4700UF 20% 80V SNAP | Forespørsel |
 |
80MXG4700MEFCSN30X35 | Rubycon | CAP ALUM 4700UF 20% 80V SNAP-IN | Forespørsel |
|
80MXG4700MEFC35X30 | Rubycon | CAP ALUM 4700UF 20% 80V SNAP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers