Kjøpe ADCMP603BCPZ-R2 med BYCHPS
Kjøp med garanti
ADCMP603BCPZ-R2
- Delenummer:
- ADCMP603BCPZ-R2
- Produsent:
- AD
- Beskrivelse:
- IC COMP TTL/CMOS 1CHAN 12-LFCSP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16912 Pieces
- Dataark:
- ADCMP603BCPZ-R2.pdf
Introduksjon
BYCHIPS er strømprodusenten for ADCMP603BCPZ-R2, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for ADCMP603BCPZ-R2 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Tilførsel, Single / Dual (±): | 2.5 V ~ 5.5 V |
|---|---|
| Spenning - Inngang Offset (Maks): | 5mV @ 2.5V |
| Type: | with Latch |
| Leverandør Enhetspakke: | 12-LFCSP-WQ (3x3) |
| Serie: | - |
| Forplantningsforsinkelse (maks): | 5ns |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 12-WFQFN Exposed Pad, CSP |
| Utgangstype: | CMOS, Complementary, Rail-to-Rail, TTL |
| Andre navn: | ADCMP603BCPZ-R2-ND ADCMP603BCPZ-R2TR |
| Driftstemperatur: | -40°C ~ 125°C |
| Antall elementer: | 1 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | ADCMP603BCPZ-R2 |
| hysterese: | 100µV |
| Utvidet beskrivelse: | Comparator with Latch CMOS, Complementary, Rail-to-Rail, TTL 12-LFCSP-WQ (3x3) |
| Beskrivelse: | IC COMP TTL/CMOS 1CHAN 12-LFCSP |
| Nåværende - Quiescent (Maks): | 1.8mA |
| Strøm - Utgang (Typ): | 50mA |
| Nåværende - Input Bias (Max): | 5µA @ 2.5V |
| CMRR, PSRR (Typ): | 50dB CMRR, 50dB PSRR |
| Email: | [email protected] |
Beslektede deler til ADCMP603BCPZ-R2
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers