Kjøpe AISC-0603-R0051J-T med BYCHPS
Kjøp med garanti
AISC-0603-R0051J-T
- Delenummer:
- AISC-0603-R0051J-T
- Produsent:
- Abracon Corporation
- Beskrivelse:
- FIXED IND 5.1NH 600MA 130 MOHM
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13652 Pieces
Introduksjon
BYCHIPS er strømprodusenten for AISC-0603-R0051J-T, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for AISC-0603-R0051J-T via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Wirewound |
|---|---|
| Toleranse: | ±5% |
| Leverandør Enhetspakke: | - |
| Størrelse / Dimensjon: | 0.070" L x 0.044" W (1.80mm x 1.12mm) |
| skjerming: | Unshielded |
| Serie: | AISC-0603 |
| rangeringer: | - |
| Q @ Freq: | 21 @ 250MHz |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | Nonstandard |
| Andre navn: | 535-10452-2 AISC0603R0051JT |
| Driftstemperatur: | -40°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale - Kjerne: | Ceramic |
| Produsentens Standard Lead Time: | 11 Weeks |
| Produsentens varenummer: | AISC-0603-R0051J-T |
| induktans: | 5.1nH |
| Høyde - sittende (maks): | 0.040" (1.02mm) |
| Frekvens - Test: | 250MHz |
| Frekvens - Selvresonans: | 6GHz |
| Utvidet beskrivelse: | 5.1nH Unshielded Wirewound Inductor 600mA 130 mOhm Max Nonstandard |
| Beskrivelse: | FIXED IND 5.1NH 600MA 130 MOHM |
| DC-motstand (DCR): | 130 mOhm Max |
| Nåværende vurdering: | 600mA |
| Nåværende - Metning: | - |
| Email: | [email protected] |
Beslektede deler til AISC-0603-R0051J-T
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers