Kjøpe APTDF100H120G med BYCHPS
Kjøp med garanti
APTDF100H120G
- Delenummer:
- APTDF100H120G
- Produsent:
- Microsemi
- Beskrivelse:
- DIODE MODULE FULL BRIDGE SP4
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18647 Pieces
- Dataark:
- APTDF100H120G.pdf
Introduksjon
BYCHIPS er strømprodusenten for APTDF100H120G, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for APTDF100H120G via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Peak Reverse (Max): | 1200V |
|---|---|
| Spenning - Videresend (Vf) (Maks) @ Hvis: | 3V @ 100A |
| Teknologi: | Standard |
| Leverandør Enhetspakke: | SP4 |
| Serie: | - |
| emballasje: | Bulk |
| Pakke / tilfelle: | SP4 |
| Driftstemperatur: | -40°C ~ 175°C (TJ) |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | APTDF100H120G |
| Utvidet beskrivelse: | Bridge Rectifier Single Phase 1200V 120A Chassis Mount SP4 |
| Diodetype: | Single Phase |
| Beskrivelse: | DIODE MODULE FULL BRIDGE SP4 |
| Strøm - Omvendt lekkasje @ Vr: | 100µA @ 1200V |
| Gjeldende - Gjennomsnittlig Rectified (Io): | 120A |
| Email: | [email protected] |
Beslektede deler til APTDF100H120G
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
APTDF100H1201G | Microsemi Corporation | DIODE MODULE FULL BRIDGE SP1 | Forespørsel |
|
APTDF100H100G | Microsemi Corporation | DIODE MODULE FULL BRIDGE SP4 | Forespørsel |
|
APTDF100H60G | Microsemi Corporation | DIODE MODULE FULL BRIDGE SP4 | Forespørsel |
|
APTDF100H601G | Microsemi Corporation | DIODE MODULE FULL BRIDGE SP1 | Forespørsel |
|
APTDF100H170G | Microsemi Corporation | DIODE MODULE FULL BRIDGE SP4 | Forespørsel |
|
APTDF100H20G | Microsemi Corporation | DIODE MODULE FULL BRIDGE SP4 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers