Kjøpe B37984M5334K051 med BYCHPS
Kjøp med garanti
B37984M5334K051
- Delenummer:
- B37984M5334K051
- Produsent:
- EPCOS
- Beskrivelse:
- CAP CER 0.33UF 50V X7R RADIAL
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13567 Pieces
- Dataark:
- B37984M5334K051.pdf
Introduksjon
BYCHIPS er strømprodusenten for B37984M5334K051, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for B37984M5334K051 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 50V |
|---|---|
| Toleranse: | ±10% |
| Tykkelse (Maks): | - |
| Temperaturkoeffisient: | X7R |
| Størrelse / Dimensjon: | 0.354" L x 0.295" W (9.00mm x 7.50mm) |
| Serie: | B37984M |
| rangeringer: | AEC-Q200 |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | Radial |
| Andre navn: | 495-3362-2 B37984M5334K 51 B37984M5334K51 |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | B37984M5334K051 |
| Lead Style: | Formed Leads - Kinked |
| Lead Spacing: | 0.197" (5.00mm) |
| Høyde - sittende (maks): | 0.098" (2.50mm) |
| Egenskaper: | - |
| Utvidet beskrivelse: | 0.33µF ±10% 50V Ceramic Capacitor X7R Radial |
| Beskrivelse: | CAP CER 0.33UF 50V X7R RADIAL |
| kapasitans: | 0.33µF |
| applikasjoner: | Automotive |
| Email: | [email protected] |
Beslektede deler til B37984M5334K051
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
B37984M5334K054 | EPCOS (TDK) | CAP CER 0.33UF 50V X7R RADIAL | Forespørsel |
 |
B37984M5334M051 | EPCOS (TDK) | CAP CER 0.33UF 50V X7R RADIAL | Forespørsel |
 |
B37984M5684K051 | EPCOS (TDK) | CAP CER 0.68UF 50V X7R RADIAL | Forespørsel |
|
B37984M5334K000 | EPCOS (TDK) | CAP CER 0.33UF 50V X7R RADIAL | Forespørsel |
|
B37984M5334K058 | EPCOS (TDK) | CAP CER 0.33UF 50V X7R RADIAL | Forespørsel |
|
B37984M5105K058 | EPCOS (TDK) | CAP CER 1UF 50V X7R RADIAL | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers