Kjøpe BCAP0003 P270 T01 med BYCHPS
Kjøp med garanti
BCAP0003 P270 T01
- Delenummer:
- BCAP0003 P270 T01
- Produsent:
- Maxwell Technologies, Inc.
- Beskrivelse:
- CAP 3.3F 2.7V THROUGH HOLE
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17474 Pieces
- Dataark:
- BCAP0003 P270 T01.pdf
Introduksjon
BYCHIPS er strømprodusenten for BCAP0003 P270 T01, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BCAP0003 P270 T01 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 2.7V |
|---|---|
| Toleranse: | - |
| Avslutning: | Through Hole |
| Størrelse / Dimensjon: | 0.394" Dia (10.00mm) |
| Serie: | HC |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can |
| Andre navn: | 109051 1182-1007 BCAP0003P270T01 |
| Driftstemperatur: | -40°C ~ 85°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 4 Weeks |
| Produsentens varenummer: | BCAP0003 P270 T01 |
| Levetid @ Temp.: | 1000 Hrs @ 65°C |
| Lead Spacing: | 0.197" (5.00mm) |
| Høyde - sittende (maks): | 0.846" (21.50mm) |
| Utvidet beskrivelse: | 3.3F (EDLC) Supercapacitor 2.7V Radial, Can 290 mOhm 1000 Hrs @ 65°C |
| ESR (ekvivalent serieresistens): | 290 mOhm |
| Beskrivelse: | CAP 3.3F 2.7V THROUGH HOLE |
| kapasitans: | 3.3F |
| Email: | [email protected] |
Beslektede deler til BCAP0003 P270 T01
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog