Kjøpe BCV47,235 med BYCHPS
Kjøp med garanti
BCV47,235
- Delenummer:
- BCV47,235
- Produsent:
- Nexperia
- Beskrivelse:
- TRANS NPN DARL 60V 0.5A SOT23
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16700 Pieces
- Dataark:
- BCV47,235.pdf
Introduksjon
BYCHIPS er strømprodusenten for BCV47,235, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BCV47,235 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 60V |
|---|---|
| Vce Metning (Maks) @ Ib, Ic: | 1V @ 100µA, 100mA |
| Transistor Type: | NPN - Darlington |
| Leverandør Enhetspakke: | TO-236AB (SOT23) |
| Serie: | Automotive, AEC-Q101 |
| Strøm - Maks: | 250mW |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | TO-236-3, SC-59, SOT-23-3 |
| Andre navn: | 1727-5462-2 568-6933-2 568-6933-2-ND 933932320235 BCV47 /T3 BCV47 /T3-ND BCV47,235-ND BCV47235 |
| Driftstemperatur: | 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 13 Weeks |
| Produsentens varenummer: | BCV47,235 |
| Frekvens - Overgang: | 220MHz |
| Utvidet beskrivelse: | Bipolar (BJT) Transistor NPN - Darlington 60V 500mA 220MHz 250mW Surface Mount TO-236AB (SOT23) |
| Beskrivelse: | TRANS NPN DARL 60V 0.5A SOT23 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 10000 @ 100mA, 5V |
| Gjeldende - Samler Cutoff (Maks): | 100nA (ICBO) |
| Nåværende - Samler (Ic) (Maks): | 500mA |
| Email: | [email protected] |
Beslektede deler til BCV47,235
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers