Kjøpe BFC238623395 med BYCHPS
Kjøp med garanti
BFC238623395
- Delenummer:
- BFC238623395
- Produsent:
- Angstrohm / Vishay
- Beskrivelse:
- CAP FILM 3.9UF 5% 630VDC SCREW
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19882 Pieces
- Dataark:
- BFC238623395.pdf
Introduksjon
BYCHIPS er strømprodusenten for BFC238623395, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BFC238623395 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier - DC: | 630V |
|---|---|
| Spenningsverdier - AC: | 220V |
| Toleranse: | ±5% |
| Avslutning: | Screw Terminals |
| Størrelse / Dimensjon: | 1.732" L x 1.181" W (44.00mm x 30.00mm) |
| Serie: | MMKP386 |
| emballasje: | Tray |
| Pakke / tilfelle: | Rectangular Box |
| Andre navn: | 222238623395 |
| Driftstemperatur: | -50°C ~ 85°C |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | BFC238623395 |
| Lead Spacing: | 0.894" (22.70mm) |
| Høyde - sittende (maks): | 1.811" (46.00mm) |
| Egenskaper: | Long Life |
| Utvidet beskrivelse: | 3.9µF ±5% Film Capacitor 220V 630V Polypropylene (PP), Metallized Rectangular Box |
| ESR (ekvivalent serieresistens): | 6 mOhm |
| Dielektrisk materiale: | Polypropylene (PP), Metallized |
| Beskrivelse: | CAP FILM 3.9UF 5% 630VDC SCREW |
| kapasitans: | 3.9µF |
| applikasjoner: | Snubber |
| Email: | [email protected] |
Beslektede deler til BFC238623395
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog