Kjøpe BO3-13 med BYCHPS
Kjøp med garanti
BO3-13
- Delenummer:
- BO3-13
- Produsent:
- Bussmann (Eaton)
- Beskrivelse:
- FUSEHOLDER CAP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14840 Pieces
- Dataark:
- BO3-13.pdf
Introduksjon
BYCHIPS er strømprodusenten for BO3-13, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BO3-13 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | - |
|---|---|
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | BO3-13 |
| For bruk med / relaterte produkter: | A3000 Series |
| Beskrivelse: | FUSEHOLDER CAP |
| Tilbehørstype: | Cap (Cover) |
| Email: | [email protected] |
Beslektede deler til BO3-13
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
4430.136 | Schurter Inc. | COLLAR CIRCUIT BRKR 2POLE | Forespørsel |
 |
BO3-02BF | Eaton | FUSEHOLDER CAP | Forespørsel |
|
BO3-07 | Eaton | FUSEHOLDER CAP | Forespørsel |
|
BO3-03TF | Eaton | FUSEHOLDER CAP | Forespørsel |
|
BO3-06TF | Eaton | FUSEHOLDER CAP | Forespørsel |
|
BO3-15 | Eaton | FUSEHOLDER CAP | Forespørsel |
|
BO3-12 | Eaton | FUSEHOLDER CAP | Forespørsel |
 |
Y30738101 | E-T-A | TOGGLE GUARD FOR 8350 SERIES | Forespørsel |
 |
C1113/43 | APM Hexseal | BOOT CIRCUIT BREAKER BACK OF PNL | Forespørsel |
|
BO3-02 | Eaton | FUSEHOLDER CAP | Forespørsel |
 |
HE1015 | APM Hexseal | BOOT CIRCUIT BREAKER 1POLE CLEAR | Forespørsel |
|
BO3-10 | Eaton | FUSEHOLDER CAP | Forespørsel |
|
BO3-04 | Eaton | FUSEHOLDER CAP | Forespørsel |
|
BO3-08 | Eaton | FUSEHOLDER CAP | Forespørsel |
|
BO3-06 | Eaton | FUSEHOLDER CAP | Forespørsel |
 |
01520903TXN | Littelfuse Inc. | COVER FOR MAXIHOLDER 152003. | Forespørsel |
|
BO3-03BF | Eaton | FUSEHOLDER CAP | Forespørsel |
|
BO3-05 | Eaton | FUSEHOLDER CAP | Forespørsel |
|
BO3-14 | Eaton | FUSEHOLDER CAP | Forespørsel |
|
BO3-03 | Eaton | FUSEHOLDER CAP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers