Kjøpe CBTV4012EE/G,518 med BYCHPS
Kjøp med garanti
CBTV4012EE/G,518
- Delenummer:
- CBTV4012EE/G,518
- Produsent:
- NXP Semiconductors / Freescale
- Beskrivelse:
- IC MUX/BUS SW 10BIT 64-TFBGA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17728 Pieces
- Dataark:
- CBTV4012EE/G,518.pdf
Introduksjon
BYCHIPS er strømprodusenten for CBTV4012EE/G,518, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for CBTV4012EE/G,518 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsforsyningskilde: | Single Supply |
|---|---|
| Spenning - Forsyning: | - |
| Type: | Multiplexer |
| Leverandør Enhetspakke: | 64-TFBGA (7x7) |
| Serie: | 74CBTV |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 64-TFBGA |
| Andre navn: | 935278478518 CBTV4012EE/G-T CBTV4012EE/G-T-ND |
| Driftstemperatur: | 0°C ~ 85°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | CBTV4012EE/G,518 |
| Utvidet beskrivelse: | Multiplexer 64-TFBGA (7x7) |
| Beskrivelse: | IC MUX/BUS SW 10BIT 64-TFBGA |
| Nåværende - Utgang Høy, Lav: | - |
| Krets: | - |
| Email: | [email protected] |
Beslektede deler til CBTV4012EE/G,518
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
CBTV4012EE,557 | NXP USA Inc. | IC MUX/BUS SW 10BIT 64TFBGA | Forespørsel |
|
CBTV4011EE,557 | NXP USA Inc. | IC 11BIT 1OF4 MUX/DEMUX 64TFBGA | Forespørsel |
|
CBTV4012EE,518 | NXP USA Inc. | IC MUX/BUS SW 10BIT 64-TFBGA | Forespørsel |
|
CBTV4012EE,551 | NXP USA Inc. | IC MUX/BUS SW 10BIT 64-TFBGA | Forespørsel |
 |
CBTV4020EE/G,118 | NXP USA Inc. | IC BUS SWITCH 20-BIT 72-TFBGA | Forespørsel |
|
CBTV4010EE,557 | NXP USA Inc. | IC 10BIT 1:4 BUS SWITCH 64-TFBGA | Forespørsel |
|
CBTV4010EE,551 | NXP USA Inc. | IC 10BIT 1:4 BUS SWITCH 64-TFBGA | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers