Kjøpe DS2109S med BYCHPS
Kjøp med garanti
DS2109S
- Delenummer:
- DS2109S
- Produsent:
- Maxim Integrated
- Beskrivelse:
- IC TERM SCSI PLUG/PLAY 28-SOIC
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 12490 Pieces
- Dataark:
- DS2109S.pdf
Introduksjon
BYCHIPS er strømprodusenten for DS2109S, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for DS2109S via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 4 V ~ 5.25 V |
|---|---|
| Type: | SCSI |
| Leverandør Enhetspakke: | 28-SOIC |
| Serie: | - |
| emballasje: | Tube |
| Pakke / tilfelle: | 28-SOIC (0.295", 7.50mm Width) |
| Driftstemperatur: | 0°C ~ 70°C |
| Antall oppsigelser: | 18 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | DS2109S |
| Utvidet beskrivelse: | SCSI Terminator Terminations 28-SOIC |
| Beskrivelse: | IC TERM SCSI PLUG/PLAY 28-SOIC |
| Email: | [email protected] |
Beslektede deler til DS2109S
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
DS2106S/T&R | Maxim Integrated | IC TERMINATOR SCSI 28-SOIC | Forespørsel |
|
DS2109S/T&R | Maxim Integrated | IC TERM SCSI PLUG/PLAY 28-SOIC | Forespørsel |
 |
DS2105Z+ | Maxim Integrated | IC SCSI TERMINATOR 16-SOIC | Forespørsel |
|
DS2106S | Maxim Integrated | IC TERMINATOR SCSI 28-SOIC | Forespørsel |
 |
DS2108S | Maxim Integrated | IC TERM SCSI DIFF/SWITCH 24-SOIC | Forespørsel |
|
DS2108S+ | Maxim Integrated | IC TERM SCSI DIFF/SWITCH 24-SOIC | Forespørsel |
|
DS2108S+T&R | Maxim Integrated | IC TERM SCSI DIFF/SWITCH 24-SOIC | Forespørsel |
|
DS2108S/T&R | Maxim Integrated | IC TERM SCSI DIFF/SWITCH 24-SOIC | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers