Kjøpe DS90C401M/NOPB med BYCHPS
Kjøp med garanti
DS90C401M/NOPB
- Delenummer:
- DS90C401M/NOPB
- Produsent:
- Beskrivelse:
- IC DRV LVDS DUAL DIFF SGNL 8SOIC
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15975 Pieces
- Dataark:
- DS90C401M/NOPB.pdf
Introduksjon
BYCHIPS er strømprodusenten for DS90C401M/NOPB, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for DS90C401M/NOPB via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 4.5 V ~ 5.5 V |
|---|---|
| Type: | Driver |
| Leverandør Enhetspakke: | 8-SOIC |
| Serie: | - |
| protokoll: | LVDS |
| emballasje: | Tube |
| Pakke / tilfelle: | 8-SOIC (0.154", 3.90mm Width) |
| Andre navn: | *DS90C401M/NOPB DS90C401MNOPB |
| Driftstemperatur: | -40°C ~ 85°C |
| Antall drivere / mottakere: | 2/0 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 6 Weeks |
| Produsentens varenummer: | DS90C401M/NOPB |
| Utvidet beskrivelse: | 2/0 Driver LVDS 8-SOIC |
| duplex: | - |
| Beskrivelse: | IC DRV LVDS DUAL DIFF SGNL 8SOIC |
| Datahastighet: | 155.5Mbps |
| Email: | [email protected] |
Beslektede deler til DS90C401M/NOPB
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
|
DS90C401M | Texas Instruments | IC DRV LVDS DUAL DIFF SGNL 8SOIC | Forespørsel |
|
DS90C401MX/NOPB | Texas Instruments | IC DVR SIGNALING DUAL DIFF 8SOIC | Forespørsel |
|
DS90C401MX | Texas Instruments | IC DVR SIGNALING DUAL DIFF 8SOIC | Forespørsel |
|
DS90C402M | Texas Instruments | IC REC LVDS DUAL DIFF SGNL 8SOIC | Forespørsel |
|
DS90C402MX/NOPB | Texas Instruments | IC RVR SIGNALING DUAL DIFF 8SOIC | Forespørsel |
|
DS90C402M/NOPB | Texas Instruments | IC REC LVDS DUAL DIFF SGNL 8SOIC | Forespørsel |
|
DS90C402MX | Texas Instruments | IC RVR SIGNALING DUAL DIFF 8SOIC | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers