Kjøpe EP3CLS200F484C8ES med BYCHPS
Kjøp med garanti
EP3CLS200F484C8ES
- Delenummer:
- EP3CLS200F484C8ES
- Produsent:
- Altera (Intel)
- Beskrivelse:
- IC FPGA 210 I/O 484FBGA
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 16181 Pieces
Introduksjon
BYCHIPS er strømprodusenten for EP3CLS200F484C8ES, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for EP3CLS200F484C8ES via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 1.15 V ~ 1.25 V |
|---|---|
| Totalt RAM-bit: | 8211456 |
| Leverandør Enhetspakke: | 484-FBGA (23x23) |
| Serie: | Cyclone® III |
| Pakke / tilfelle: | 484-BGA |
| Driftstemperatur: | 0°C ~ 85°C (TJ) |
| Antall logiske elementer / celler: | 198464 |
| Antall LAB / CLBer: | 12404 |
| Antall I / O: | 210 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | EP3CLS200F484C8ES |
| Beskrivelse: | IC FPGA 210 I/O 484FBGA |
| Email: | [email protected] |
Beslektede deler til EP3CLS200F484C8ES
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
EP3CLS200F484C8 | Altera | IC FPGA 210 I/O 484FBGA | Forespørsel |
|
EP3CLS200F484C7N | Altera | IC FPGA 210 I/O 484FBGA | Forespørsel |
|
EP3CLS200F484C7 | Altera | IC FPGA 210 I/O 484FBGA | Forespørsel |
|
EP3CLS200F484I7N | Altera | IC FPGA 210 I/O 484FBGA | Forespørsel |
|
EP3CLS200F484C8N | Altera | IC FPGA 210 I/O 484FBGA | Forespørsel |
|
EP3CLS200F484I7 | Altera | IC FPGA 210 I/O 484FBGA | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers