Kjøpe EPC2103ENGRT med BYCHPS
Kjøp med garanti
EPC2103ENGRT
- Delenummer:
- EPC2103ENGRT
- Produsent:
- EPC
- Beskrivelse:
- TRANS GAN SYM HALF BRDG 80V
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19864 Pieces
- Dataark:
- EPC2103ENGRT.pdf
Introduksjon
BYCHIPS er strømprodusenten for EPC2103ENGRT, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for EPC2103ENGRT via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Vgs (th) (Maks) @ Id: | 2.5V @ 7mA |
|---|---|
| Leverandør Enhetspakke: | Die |
| Serie: | eGaN® |
| Rds På (Maks) @ Id, Vgs: | 5.5 mOhm @ 20A, 5V |
| Strøm - Maks: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | Die |
| Andre navn: | 917-1146-2 917-1146-2-ND 917-EPC2103ENGRT 917-EPC2103ENGRTR |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | EPC2103ENGRT |
| Inputkapasitans (Ciss) (Maks) @ Vds: | 7600pF @ 40V |
| Gateavgift (Qg) (Maks) @ Vgs: | 6.5nC @ 5V |
| FET Type: | 2 N-Channel (Half Bridge) |
| FET-funksjonen: | GaNFET (Gallium Nitride) |
| Utvidet beskrivelse: | Mosfet Array 2 N-Channel (Half Bridge) 80V 23A Surface Mount Die |
| Drain til Source Voltage (VDSS): | 80V |
| Beskrivelse: | TRANS GAN SYM HALF BRDG 80V |
| Strøm - Kontinuerlig avløp (Id) @ 25 ° C: | 23A |
| Email: | [email protected] |
Beslektede deler til EPC2103ENGRT
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
EPC2106ENGRT | EPC | TRANS GAN 2N-CH 100V BUMPED DIE | Forespørsel |
 |
EPC2105ENGRT | EPC | MOSFET 2NCH 80V 9.5A DIE | Forespørsel |
|
EPC2100ENG | EPC | TRANS GAN 2N-CH 30V BUMPED DIE | Forespørsel |
 |
EPC2104ENG | EPC | TRANS GAN 2N-CH 100V BUMPED DIE | Forespørsel |
|
EPC2103ENG | EPC | TRANS GAN 2N-CH 80V BUMPED DIE | Forespørsel |
|
EPC2102ENG | EPC | TRANS GAN 2N-CH 60V BUMPED DIE | Forespørsel |
 |
EPC2110ENGRT | EPC | TRANS GAN 2N-CH 120V BUMPED DIE | Forespørsel |
 |
EPC2107ENGRT | EPC | TRANS GAN 3N-CH 100V BUMPED DIE | Forespørsel |
|
EPC2108ENGRT | EPC | TRANS GAN 3N-CH BUMPED DIE | Forespørsel |
|
EPC2102ENGRT | EPC | MOSFET ARRAY 2N-CH 60V DIE | Forespørsel |
|
EPC2104ENGRT | EPC | MOSFET 2NCH 100V 23A DIE | Forespørsel |
|
EPC2100ENGRT | EPC | MOSFET ARRAY 2N-CH 30V DIE | Forespørsel |
|
EPC2105ENG | EPC | TRANS GAN 2N-CH 80V BUMPED DIE | Forespørsel |
|
EPC2101ENGRT | EPC | TRANS GAN ASYMMETRICAL HALF BRID | Forespørsel |
|
EPC2101ENG | EPC | TRANS GAN 2N-CH 60V BUMPED DIE | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers