Kjøpe FSB50250AS med BYCHPS
Kjøp med garanti
FSB50250AS
- Delenummer:
- FSB50250AS
- Produsent:
- Fairchild/ON Semiconductor
- Beskrivelse:
- MODULE SPM 500V 1.2A SPM5Q
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18151 Pieces
- Dataark:
- FSB50250AS.pdf
Introduksjon
BYCHIPS er strømprodusenten for FSB50250AS, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for FSB50250AS via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Isolasjon: | 1500Vrms |
|---|---|
| Spenning: | 500V |
| Type: | MOSFET |
| Serie: | Motion-SPM® |
| Pakke / tilfelle: | 23-PowerSMD Module, Gull Wing |
| Andre navn: | FSB50250ASCT |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens Standard Lead Time: | 45 Weeks |
| Produsentens varenummer: | FSB50250AS |
| Utvidet beskrivelse: | Power Driver Module MOSFET 3 Phase 500V 1.2A 23-PowerSMD Module, Gull Wing |
| Beskrivelse: | MODULE SPM 500V 1.2A SPM5Q |
| Nåværende: | 1.2A |
| konfigurasjon: | 3 Phase |
| Email: | [email protected] |
Beslektede deler til FSB50250AS
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
FSB50250S | Fairchild/ON Semiconductor | IC SMART POWER MOD 2A SPM23-BA | Forespørsel |
 |
FSB50250AB | Fairchild/ON Semiconductor | FET 3PH 500V 1.2A MODULE | Forespørsel |
 |
FSB50250UD | Fairchild/ON Semiconductor | MOD SPM 500V 1.1A SPM23-HD | Forespørsel |
 |
FSB50250 | Fairchild/ON Semiconductor | IC SMART POWER MOD 2A SPM23-AA | Forespørsel |
 |
FSB50250UTD | Fairchild/ON Semiconductor | MOD SPM 500V 1.1A SPM23-ED | Forespørsel |
 |
FSB50250US | Fairchild/ON Semiconductor | MODULE SPM 500V 1.1A SPM23BD | Forespørsel |
 |
FSB50250AT | Fairchild/ON Semiconductor | MODULE SPM 500V 1.2A SPM5N | Forespørsel |
 |
FSB50250A | Fairchild/ON Semiconductor | MODULE SPM 500V 1.2A SPM5P | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers