Kjøpe ICS557G-06T med BYCHPS
Kjøp med garanti
ICS557G-06T
- Delenummer:
- ICS557G-06T
- Produsent:
- IDT (Integrated Device Technology)
- Beskrivelse:
- IC CLK BUFFER 1:4 HCSL 20-TSSOP
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 15342 Pieces
- Dataark:
- ICS557G-06T.pdf
Introduksjon
BYCHIPS er strømprodusenten for ICS557G-06T, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for ICS557G-06T via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 3.135 V ~ 3.465 V |
|---|---|
| Leverandør Enhetspakke: | 20-TSSOP |
| Serie: | - |
| Forhold - Input: Output: | 2:4 |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 20-TSSOP (0.173", 4.40mm Width) |
| PLL: | No |
| Produksjon: | HCSL, LVDS |
| Andre navn: | 557G-06T |
| Driftstemperatur: | 0°C ~ 70°C |
| Antall kretser: | 1 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | ICS557G-06T |
| Hovedhensikt: | PCI Express (PCIe) |
| Input: | HCSL, LVDS |
| Frekvens - Maks: | 200MHz |
| Differensial - Input: Output: | Yes/Yes |
| Beskrivelse: | IC CLK BUFFER 1:4 HCSL 20-TSSOP |
| Email: | [email protected] |
Beslektede deler til ICS557G-06T
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers