Kjøpe LFT30030FBC med BYCHPS
Kjøp med garanti
LFT30030FBC
- Delenummer:
- LFT30030FBC
- Produsent:
- Littelfuse
- Beskrivelse:
- 300V 30A CLASS T LFT FUSE COVER
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13414 Pieces
- Dataark:
- LFT30030FBC.pdf
Introduksjon
BYCHIPS er strømprodusenten for LFT30030FBC, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for LFT30030FBC via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | LF |
|---|---|
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 14 Weeks |
| Produsentens varenummer: | LFT30030FBC |
| For bruk med / relaterte produkter: | Fuseholder; LF |
| Beskrivelse: | 300V 30A CLASS T LFT FUSE COVER |
| Tilbehørstype: | Cover |
| Email: | [email protected] |
Beslektede deler til LFT30030FBC
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
LFT300303C | Littelfuse Inc. | FUSE BLOK CART 300V 30A DIN RAIL | Forespørsel |
|
LFT300302C | Littelfuse Inc. | FUSE BLOK CART 300V 30A DIN RAIL | Forespørsel |
|
LFT300602C | Littelfuse Inc. | FUSE BLOK CART 300V 60A DIN RAIL | Forespørsel |
|
LFT302003CS | Littelfuse Inc. | FUSE BLOCK CART 300V 200A DIN | Forespørsel |
|
LFT300301C | Littelfuse Inc. | FUSE BLOK CART 300V 30A DIN RAIL | Forespørsel |
|
LFT30100FBC | Littelfuse Inc. | 300V 100A CLASS T LFT FUSE COVER | Forespørsel |
|
LFT300601C | Littelfuse Inc. | FUSE BLOK CART 300V 60A DIN RAIL | Forespørsel |
|
LFT301001CS | Littelfuse Inc. | FUSE BLOCK CART 300V 100A DIN | Forespørsel |
|
LFT304003CS | Littelfuse Inc. | FUSE BLOCK CART 300V 400A DIN | Forespørsel |
|
LFT300603C | Littelfuse Inc. | FUSE BLOK CART 300V 60A DIN RAIL | Forespørsel |
|
LFT30060FBC | Littelfuse Inc. | 300V 60A CLASS T LFT FUSE COVER | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers