Kjøpe LT1370IR#TRPBF med BYCHPS
Kjøp med garanti
LT1370IR#TRPBF
- Delenummer:
- LT1370IR#TRPBF
- Produsent:
- L
- Beskrivelse:
- IC REG MULT CONFIG INV ADJ D2PAK
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15069 Pieces
- Dataark:
- LT1370IR#TRPBF.pdf
Introduksjon
BYCHIPS er strømprodusenten for LT1370IR#TRPBF, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for LT1370IR#TRPBF via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Utgang (Min / Fast): | 1.245V |
|---|---|
| Spenning - utgang (maks): | 35V (Switch) |
| Spenning - Inngang (Min): | 2.7V |
| Spenning - Inngang (Maks): | 30V |
| topologi: | Buck, Boost, Cuk, Flyback, Forward Converter, SEPIC |
| Synkron Likner: | No |
| Leverandør Enhetspakke: | D2PAK-7 |
| Serie: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | TO-263-8, D²Pak (7 Leads + Tab), TO-263CA |
| Utgangstype: | Adjustable |
| Utgangskonfigurasjon: | Positive or Negative |
| Driftstemperatur: | 0°C ~ 70°C (TA) |
| Antall utganger: | 1 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 4 Weeks |
| Produsentens varenummer: | LT1370IR#TRPBF |
| Funksjon: | Step-Up, Step-Down, Step-Up/Step-Down |
| Frekvens - Bytte: | 500kHz |
| Utvidet beskrivelse: | Buck, Boost, Cuk, Flyback, Forward Converter, SEPIC Switching Regulator IC Positive or Negative Adjustable 1.245V 1 Output 6A (Switch) TO-263-8, D²Pak (7 Leads + Tab), TO-263CA |
| Beskrivelse: | IC REG MULT CONFIG INV ADJ D2PAK |
| Strøm - Utgang: | 6A (Switch) |
| Email: | [email protected] |
Beslektede deler til LT1370IR#TRPBF
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog