Kjøpe LT1783CS6#TRMPBF med BYCHPS
Kjøp med garanti
LT1783CS6#TRMPBF
- Delenummer:
- LT1783CS6#TRMPBF
- Produsent:
- L
- Beskrivelse:
- IC OPAMP GP 1.3MHZ RRO TSOT23-6
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15375 Pieces
- Dataark:
- LT1783CS6#TRMPBF.pdf
Introduksjon
BYCHIPS er strømprodusenten for LT1783CS6#TRMPBF, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for LT1783CS6#TRMPBF via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Tilførsel, Single / Dual (±): | 2.5 V ~ 18 V, ±1.25 V ~ 9 V |
|---|---|
| Spenning - Inngangsforskyvning: | 500µV |
| Leverandør Enhetspakke: | TSOT-23-6 |
| Slew Rate: | 0.45 V/µs |
| Serie: | Over-The-Top® |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | SOT-23-6 Thin, TSOT-23-6 |
| Utgangstype: | Rail-to-Rail |
| Andre navn: | LT1783CS6#PBF LT1783CS6#PBF-ND LT1783CS6#TRMPBF-ND LT1783CS6#TRMPBFTR LT1783CS6TRMPBF |
| Driftstemperatur: | 0°C ~ 70°C |
| Antall kretser: | 1 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 4 Weeks |
| Produsentens varenummer: | LT1783CS6#TRMPBF |
| Få båndbreddeprodukt: | 1.3MHz |
| Utvidet beskrivelse: | General Purpose Amplifier 1 Circuit Rail-to-Rail TSOT-23-6 |
| Beskrivelse: | IC OPAMP GP 1.3MHZ RRO TSOT23-6 |
| Strøm - Forsyning: | 230µA |
| Strøm - Utgang / Kanal: | 30mA |
| Nåværende - Input Bias: | 40nA |
| Forsterkertype: | General Purpose |
| -3db Båndbredde: | - |
| Email: | [email protected] |
Beslektede deler til LT1783CS6#TRMPBF
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers