Kjøpe MAX13032EEBE+T med BYCHPS
Kjøp med garanti
MAX13032EEBE+T
- Delenummer:
- MAX13032EEBE+T
- Produsent:
- Maxim Integrated
- Beskrivelse:
- IC LEVEL TRANS 6CH 16-UCSP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16272 Pieces
Introduksjon
BYCHIPS er strømprodusenten for MAX13032EEBE+T, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MAX13032EEBE+T via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - VCCB: | 2.2 V ~ 3.6 V |
|---|---|
| Spenning - VCCA: | 1.62 V ~ 3.2 V |
| Oversetter Type: | Voltage Level |
| Leverandør Enhetspakke: | 16-UCSP (2x2) |
| Serie: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 16-WFBGA, CSPBGA |
| Utgangstype: | Open Drain, Push-Pull |
| Utgangssignal: | - |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Antall kretser: | 1 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | MAX13032EEBE+T |
| Inngangssignal: | - |
| Egenskaper: | Power Supply Decoupling |
| Utvidet beskrivelse: | Voltage Level Translator Bidirectional 1 Circuit 6 Channel 100Mbps 16-UCSP (2x2) |
| Beskrivelse: | IC LEVEL TRANS 6CH 16-UCSP |
| Datahastighet: | 100Mbps |
| Kanaler per krets: | 6 |
| Kanaltype: | Bidirectional |
| Email: | [email protected] |
Beslektede deler til MAX13032EEBE+T
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers