Kjøpe MAX3736ETE+ med BYCHPS
Kjøp med garanti
MAX3736ETE+
- Delenummer:
- MAX3736ETE+
- Produsent:
- Maxim Integrated
- Beskrivelse:
- IC LSR DRVR 3.2GBPS 3.63V 16TQFN
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16160 Pieces
Introduksjon
BYCHIPS er strømprodusenten for MAX3736ETE+, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MAX3736ETE+ via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 2.97 V ~ 3.63 V |
|---|---|
| Type: | Laser Diode Driver (Fiber Optic) |
| Leverandør Enhetspakke: | 16-TQFN (3x3) |
| Serie: | - |
| emballasje: | Tube |
| Pakke / tilfelle: | 16-WFQFN Exposed Pad |
| Driftstemperatur: | -40°C ~ 85°C |
| Antall kanaler: | 1 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 6 Weeks |
| Produsentens varenummer: | MAX3736ETE+ |
| Utvidet beskrivelse: | Laser Driver IC 3.2Gbps 1 Channel 2.97 V ~ 3.63 V 16-TQFN (3x3) |
| Beskrivelse: | IC LSR DRVR 3.2GBPS 3.63V 16TQFN |
| Datahastighet: | 3.2Gbps |
| Strøm - Forsyning: | 22mA |
| Strøm - Modulasjon: | 85mA |
| Nåværende - Bias: | 100mA |
| Email: | [email protected] |
Beslektede deler til MAX3736ETE+
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers