Kjøpe MXLSMBJ170CAE3 med BYCHPS
Kjøp med garanti
MXLSMBJ170CAE3
- Delenummer:
- MXLSMBJ170CAE3
- Produsent:
- Microsemi
- Beskrivelse:
- TVS DIODE 170VWM 275VC DO214AA
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 12409 Pieces
- Dataark:
- MXLSMBJ170CAE3.pdf
Introduksjon
BYCHIPS er strømprodusenten for MXLSMBJ170CAE3, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MXLSMBJ170CAE3 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Omvendt avstengning (Typ): | 170V |
|---|---|
| Spenning - Spenning (Maks) @ Ipp: | 275V |
| Spenning - Fordeling (Min): | 189V |
| Type: | Zener |
| Leverandør Enhetspakke: | SMBJ (DO-214AA) |
| Serie: | Military, MIL-PRF-19500 |
| Power Line Protection: | No |
| Power - Peak Pulse: | 600W |
| emballasje: | Bulk |
| Pakke / tilfelle: | DO-214AA, SMB |
| Andre navn: | 1086-11604 1086-11604-MIL |
| Driftstemperatur: | -65°C ~ 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | MXLSMBJ170CAE3 |
| Beskrivelse: | TVS DIODE 170VWM 275VC DO214AA |
| Strøm - Peak Pulse (10 / 1000μs): | 2.2A |
| Kapasitans @ Frekvens: | - |
| Toveis kanaler: | 1 |
| applikasjoner: | General Purpose |
| Email: | [email protected] |
Beslektede deler til MXLSMBJ170CAE3
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers