Kjøpe NT25L59-WP med BYCHPS
Kjøp med garanti
NT25L59-WP
- Delenummer:
- NT25L59-WP
- Produsent:
- Semtech
- Beskrivelse:
- IC AMP TIA 2.5G AGC GPON PD DIE
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13586 Pieces
- Dataark:
- NT25L59-WP.pdf
Introduksjon
BYCHIPS er strømprodusenten for NT25L59-WP, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for NT25L59-WP via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Transimpedance Amplifier |
|---|---|
| Leverandør Enhetspakke: | Die |
| Serie: | - |
| emballasje: | Tray |
| Pakke / tilfelle: | Die |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | NT25L59-WP |
| Utvidet beskrivelse: | Transimpedance Amplifier IC Die |
| Beskrivelse: | IC AMP TIA 2.5G AGC GPON PD DIE |
| applikasjoner: | - |
| Email: | [email protected] |
Beslektede deler til NT25L59-WP
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
NT25L51-WP | Semtech Corporation | IC AMP TIA AGC OC48/GPONG DIE | Forespørsel |
|
NT25L55-DTF8SR | Semtech Corporation | IC AMP TIA BARE DIE | Forespørsel |
|
NT25L59-PR | Semtech Corporation | IC AMP TIA 2.5G AGC GPON PD DIE | Forespørsel |
|
NT25L59-GRP6 | Semtech Corporation | IC AMP TIA 2.5G AGC GPON PD DIE | Forespørsel |
|
NT25L55-PR | Semtech Corporation | IC AMP TIA BARE DIE | Forespørsel |
|
NT25L51-PR | Semtech Corporation | IC AMP TIA AGC OC48/GPONG DIE | Forespørsel |
|
NT25L59-DTF8S | Semtech Corporation | IC AMP TIA 2.5G AGC GPON PD DIE | Forespørsel |
|
NT25L59-GRP8 | Semtech Corporation | IC AMP TIA 2.5G AGC GPON PD DIE | Forespørsel |
|
NT25L91-QFN-TR | Semtech Corporation | IC TXRX LDD&LA 2.5GBPS 28QFN | Forespørsel |
|
NT25L51-GRP8 | Semtech Corporation | IC AMP TIA AGC OC48/GPONG DIE | Forespørsel |
|
NT25L51-GRP6 | Semtech Corporation | IC AMP TIA AGC OC48/GPONG DIE | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers