Kjøpe P1AFS600-2FGG484 med BYCHPS
Kjøp med garanti
P1AFS600-2FGG484
- Delenummer:
- P1AFS600-2FGG484
- Produsent:
- Microsemi
- Beskrivelse:
- IC FPGA 172 I/O 484FBGA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12340 Pieces
- Dataark:
- P1AFS600-2FGG484.pdf
Introduksjon
BYCHIPS er strømprodusenten for P1AFS600-2FGG484, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for P1AFS600-2FGG484 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 1.425 V ~ 1.575 V |
|---|---|
| Totalt RAM-bit: | 110592 |
| Leverandør Enhetspakke: | 484-FPBGA (23x23) |
| Serie: | Fusion® |
| Pakke / tilfelle: | 484-BGA |
| Driftstemperatur: | 0°C ~ 85°C (TJ) |
| Antall I / O: | 172 |
| Antall porte: | 600000 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | P1AFS600-2FGG484 |
| Beskrivelse: | IC FPGA 172 I/O 484FBGA |
| Email: | [email protected] |
Beslektede deler til P1AFS600-2FGG484
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
P1AFS600-2FG256I | Microsemi Corporation | IC FPGA 119 I/O 256FBGA | Forespørsel |
 |
P1AFS600-2FG484 | Microsemi Corporation | IC FPGA 172 I/O 484FBGA | Forespørsel |
|
P1AFS600-2FG484I | Microsemi Corporation | IC FPGA 172 I/O 484FBGA | Forespørsel |
 |
P1AFS600-2FGG256 | Microsemi Corporation | IC FPGA 119 I/O 256FBGA | Forespørsel |
|
P1AFS600-2FGG256I | Microsemi Corporation | IC FPGA 119 I/O 256FBGA | Forespørsel |
|
P1AFS600-2FG256 | Microsemi Corporation | IC FPGA 119 I/O 256FBGA | Forespørsel |
|
P1AFS600-2FGG484I | Microsemi Corporation | IC FPGA 172 I/O 484FBGA | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog