Kjøpe P850-G200-WH med BYCHPS
Kjøp med garanti
P850-G200-WH
- Delenummer:
- P850-G200-WH
- Produsent:
- Bourns, Inc.
- Beskrivelse:
- SURGE SUPP TBU 200MA 850VIMP SMD
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14489 Pieces
- Dataark:
- P850-G200-WH.pdf
Introduksjon
BYCHIPS er strømprodusenten for P850-G200-WH, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for P850-G200-WH via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Arbeide: | 425V |
|---|---|
| Spenning - klemme: | - |
| Teknologi: | Internal Switch |
| Leverandør Enhetspakke: | 10-DFN (4x8.25) |
| Serie: | TBU® |
| Strøm (Watts): | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 6-SMD, No Lead |
| Andre navn: | P850G200WH |
| Antall kretser: | 2 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens Standard Lead Time: | 14 Weeks |
| Produsentens varenummer: | P850-G200-WH |
| Beskrivelse: | SURGE SUPP TBU 200MA 850VIMP SMD |
| applikasjoner: | SLIC |
| Email: | [email protected] |
Beslektede deler til P850-G200-WH
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
P850-U260-WH | Bourns Inc. | SURGE SUP TBU ETH 260MA 850VIMP | Forespørsel |
 |
P850-G120-WHX | Bourns Inc. | CIRCUIT PROT 100MA 850VIMP TBU | Forespørsel |
|
P850-G120-WH | Bourns Inc. | SURGE SUPP TBU 100MA 850VIMP SMD | Forespørsel |
|
P850-U180-WH | Bourns Inc. | SURGE SUP TBU ETH 180MA 850VIMP | Forespørsel |
|
P850-U180-WHX | Bourns Inc. | CIRCT PROT ETH 180MA 850VIMP TBU | Forespørsel |
|
P850-G200-WHX | Bourns Inc. | CIRCUIT PROT 200MA 850VIMP TBU | Forespørsel |
|
P850-U260-WHX | Bourns Inc. | CIRCT PROT ETH 260MA 850VIMP TBU | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers