Kjøpe PCS3P7300AG-08TT med BYCHPS
Kjøp med garanti
PCS3P7300AG-08TT
- Delenummer:
- PCS3P7300AG-08TT
- Produsent:
- AMI Semiconductor / ON Semiconductor
- Beskrivelse:
- IC CLK EMI REDUCTION FREQ 8TSSOP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14180 Pieces
- Dataark:
- PCS3P7300AG-08TT.pdf
Introduksjon
BYCHIPS er strømprodusenten for PCS3P7300AG-08TT, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for PCS3P7300AG-08TT via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | - |
|---|---|
| Leverandør Enhetspakke: | 8-TSSOP |
| Serie: | - |
| Forhold - Input: Output: | - |
| emballasje: | Tube |
| Pakke / tilfelle: | 8-TSSOP (0.173", 4.40mm Width) |
| PLL: | - |
| Produksjon: | - |
| Andre navn: | PCS3P7300AG-08-TT |
| Driftstemperatur: | - |
| Antall kretser: | - |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | PCS3P7300AG-08TT |
| Input: | - |
| Frekvens - Maks: | - |
| Divider / Multiplier: | - |
| Differensial - Input: Output: | - |
| Beskrivelse: | IC CLK EMI REDUCTION FREQ 8TSSOP |
| Email: | [email protected] |
Beslektede deler til PCS3P7300AG-08TT
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
PCS3P7300AG-08ST | ON Semiconductor | IC CLK EMI REDUCTION FREQ 8SOIC | Forespørsel |
|
PCS3P7300AG-08TR | ON Semiconductor | IC CLK EMI REDUCTION FREQ 8TSSOP | Forespørsel |
|
PCS3P73U00AG08TR | ON Semiconductor | IC CLK EMI REDUCTION FREQ 8TSSOP | Forespørsel |
|
PCS3P7300AG-08SR | ON Semiconductor | IC CLK EMI REDUCTION FREQ 8SOIC | Forespørsel |
 |
PCS3P7303AG-08CR | ON Semiconductor | IC CLK EMI REDUCTION FREQ 8WDFN | Forespørsel |
|
PCS3P7303AG-08TR | ON Semiconductor | IC CLK EMI REDUCTION FREQ 8WDFN | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers