Kjøpe RLS-73TE-11 med BYCHPS
Kjøp med garanti
RLS-73TE-11
- Delenummer:
- RLS-73TE-11
- Produsent:
- LAPIS Semiconductor
- Beskrivelse:
- DIODE GEN PURP 80V 130MA LLDS
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12353 Pieces
- Dataark:
- RLS-73TE-11.pdf
Introduksjon
BYCHIPS er strømprodusenten for RLS-73TE-11, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for RLS-73TE-11 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Videresend (Vf) (Maks) @ Hvis: | 1.2V @ 100mA |
|---|---|
| Spenning - DC-omvendt (Vr) (Maks): | 80V |
| Leverandør Enhetspakke: | LLDS |
| Hastighet: | Small Signal =< 200mA (Io), Any Speed |
| Serie: | - |
| Omvendt gjenopprettingstid (trr): | 4ns |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | DO-213AC, MINI-MELF, SOD-80 |
| Driftstemperatur - Kobling: | -65°C ~ 175°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | RLS-73TE-11 |
| Utvidet beskrivelse: | Diode Standard 80V 130mA Surface Mount LLDS |
| Diodetype: | Standard |
| Beskrivelse: | DIODE GEN PURP 80V 130MA LLDS |
| Strøm - Omvendt lekkasje @ Vr: | 500nA @ 80V |
| Gjeldende - Gjennomsnittlig Rectified (Io): | 130mA |
| Kapasitans @ Vr, F: | 2pF @ 0.5V, 1MHz |
| Email: | [email protected] |
Beslektede deler til RLS-73TE-11
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers