Kjøpe RSL112200 med BYCHPS
Kjøp med garanti
RSL112200
- Delenummer:
- RSL112200
- Produsent:
- Amphenol Pcd
- Beskrivelse:
- MCDONNEL DOUGLAS
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15123 Pieces
- Dataark:
- RSL112200.pdf
Introduksjon
BYCHIPS er strømprodusenten for RSL112200, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for RSL112200 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | * |
|---|---|
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 12 Weeks |
| Produsentens varenummer: | RSL112200 |
| Utvidet beskrivelse: | Relay |
| Beskrivelse: | MCDONNEL DOUGLAS |
| Email: | [email protected] |
Beslektede deler til RSL112200
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
RSL112214 | Amphenol PCD | MCDONNEL DOUGLAS | Forespørsel |
|
RSL116144 | Amphenol PCD | MCDONNEL DOUGLAS | Forespørsel |
|
RSL112105-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Forespørsel |
|
RSL112100-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Forespørsel |
|
RSL112202 | Amphenol PCD | MCDONNEL DOUGLAS | Forespørsel |
|
RSL112101-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Forespørsel |
|
RSL112206 | Amphenol PCD | MCDONNEL DOUGLAS | Forespørsel |
|
RSL116072 | Amphenol PCD | EXTENDED HEIGHT, 6 POLE/10 AMP, | Forespørsel |
|
RSL116062 | Amphenol PCD | EXTENDED HEIGHT, 2 POLE/10 AMP, | Forespørsel |
|
RSL112100 | Amphenol PCD | EXTENDED HEIGHT, 3 POLE/25 AMP, | Forespørsel |
|
RSL116061-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Forespørsel |
|
RSL112101 | Amphenol PCD | EXTENDED HEIGHT, 3 POLE/25 AMP, | Forespørsel |
|
RSL116130 | Amphenol PCD | MCDONNEL DOUGLAS | Forespørsel |
|
RSL116081 | Amphenol PCD | EXTENDED HEIGHT, 4 POLE/10 AMP, | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers