Kjøpe STGIPL30C60-H med BYCHPS
Kjøp med garanti
STGIPL30C60-H
- Delenummer:
- STGIPL30C60-H
- Produsent:
- ST
- Beskrivelse:
- MOD IPM SLLIMM 8PHASE 38SDIP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19492 Pieces
- Dataark:
- STGIPL30C60-H.pdf
Introduksjon
BYCHIPS er strømprodusenten for STGIPL30C60-H, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for STGIPL30C60-H via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Isolasjon: | 2500Vrms |
|---|---|
| Spenning: | 600V |
| Type: | IGBT |
| Serie: | SLLIMM™ |
| Pakke / tilfelle: | 38-PowerDIP Module (1.146", 29.10mm) |
| Andre navn: | 497-15541-5 |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | STGIPL30C60-H |
| Utvidet beskrivelse: | Power Driver Module IGBT 3 Phase 600V 30A 38-PowerDIP Module (1.146", 29.10mm) |
| Beskrivelse: | MOD IPM SLLIMM 8PHASE 38SDIP |
| Nåværende: | 30A |
| konfigurasjon: | 3 Phase |
| Email: | [email protected] |
Beslektede deler til STGIPL30C60-H
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
STGIPL14K60-S | STMicroelectronics | IGBT IPM MODULE 14A 600V 38SDIP | Forespørsel |
|
STGIPL20K60 | STMicroelectronics | MOD IPM 3PH INVERTER 38SDIP | Forespørsel |
|
STGIPL14K60 | STMicroelectronics | IGBT IPM MODULE 14A 600V 38SDIP | Forespørsel |
 |
STGIPL35K120L1 | STMicroelectronics | POWER DRIVER IGBT 1200V SDIP-18L | Forespørsel |
 |
IKCM15H60HAXKMA1 | Infineon Technologies | IFPS MODULES 24MDIP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers