Kjøpe STGWA80H65DFB med BYCHPS
Kjøp med garanti
STGWA80H65DFB
- Delenummer:
- STGWA80H65DFB
- Produsent:
- ST
- Beskrivelse:
- IGBT BIPO 650V 80A TO247-3
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19906 Pieces
- Dataark:
- STGWA80H65DFB.pdf
Introduksjon
BYCHIPS er strømprodusenten for STGWA80H65DFB, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for STGWA80H65DFB via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 650V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 2V @ 15V, 80A |
| Testtilstand: | 400V, 80A, 10 Ohm, 15V |
| Td (på / av) @ 25 ° C: | 84ns/280ns |
| Bytte energi: | 2.1mJ (on), 1.5mJ (off) |
| Leverandør Enhetspakke: | TO-247 Long Leads |
| Serie: | - |
| Omvendt gjenopprettingstid (trr): | 85ns |
| Strøm - Maks: | 469W |
| emballasje: | Tube |
| Pakke / tilfelle: | TO-247-3 |
| Andre navn: | 497-16007-5 STGWA80H65DFB-ND |
| Driftstemperatur: | -55°C ~ 175°C (TJ) |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 20 Weeks |
| Produsentens varenummer: | STGWA80H65DFB |
| Inngangstype: | Standard |
| IGBT Type: | Trench Field Stop |
| Gate Charge: | 414nC |
| Utvidet beskrivelse: | IGBT Trench Field Stop 650V 120A 469W Through Hole TO-247 Long Leads |
| Beskrivelse: | IGBT BIPO 650V 80A TO247-3 |
| Nåværende - Samlerpulserte (Icm): | 240A |
| Nåværende - Samler (Ic) (Maks): | 120A |
| Email: | [email protected] |
Beslektede deler til STGWA80H65DFB
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers