Kjøpe STIPN1M50T-H med BYCHPS
Kjøp med garanti
STIPN1M50T-H
- Delenummer:
- STIPN1M50T-H
- Produsent:
- ST
- Beskrivelse:
- SLLIMM-NANO SMALL LOW-LOSS INTEL
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16073 Pieces
- Dataark:
- STIPN1M50T-H.pdf
Introduksjon
BYCHIPS er strømprodusenten for STIPN1M50T-H, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for STIPN1M50T-H via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Isolasjon: | 1000Vrms |
|---|---|
| Spenning: | 500V |
| Type: | MOSFET |
| Serie: | SLLIMM™ |
| Pakke / tilfelle: | 26-PowerDIP Module (0.846", 21.48mm) |
| Andre navn: | 497-17024 |
| Produsentens varenummer: | STIPN1M50T-H |
| Utvidet beskrivelse: | Power Driver Module MOSFET 3 Phase Inverter 500V 1A 26-PowerDIP Module (0.846", 21.48mm) |
| Beskrivelse: | SLLIMM-NANO SMALL LOW-LOSS INTEL |
| Nåværende: | 1A |
| konfigurasjon: | 3 Phase Inverter |
| Email: | [email protected] |
Beslektede deler til STIPN1M50T-H
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
STGIB10CH60TS-L | STMicroelectronics | SLLIMM(TM) - 2ND SERIES IPM, 3-P | Forespørsel |
 |
STIPN2M50-H | STMicroelectronics | POWER DRVR MOD 500V 2A 26DIP MOD | Forespørsel |
|
STIPN2M50T-H | STMicroelectronics | POWER DRVR MOD 500V 2A 26DIP MOD | Forespørsel |
|
STIPN1M50-H | STMicroelectronics | SLLIMM-NANO SMALL LOW-LOSS INTEL | Forespørsel |
 |
FSBB30CH60B | Fairchild/ON Semiconductor | MODULE SPM 600V 30A 3PH SPM27-EC | Forespørsel |
|
STIPN2M50T-HL | STMicroelectronics | POWER DRVR MOD 500V 2A 26DIP MOD | Forespørsel |
 |
PS21661-RZ | Powerex Inc. | MOD IPM 600V 3A SIP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers