Kjøpe TISP7125F3P med BYCHPS
Kjøp med garanti
TISP7125F3P
- Delenummer:
- TISP7125F3P
- Produsent:
- Bourns, Inc.
- Beskrivelse:
- SURGE SUPP 100V BIDIR 8-DIP
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 17028 Pieces
- Dataark:
- TISP7125F3P.pdf
Introduksjon
BYCHIPS er strømprodusenten for TISP7125F3P, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for TISP7125F3P via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - på stat: | 5V |
|---|---|
| Spenning - Off State: | 100V |
| Spenning - Breakover: | 125V |
| Serie: | - |
| emballasje: | Tube |
| Pakke / tilfelle: | 8-DIP (0.300", 7.62mm) |
| Antall elementer: | 3 |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | TISP7125F3P |
| Beskrivelse: | SURGE SUPP 100V BIDIR 8-DIP |
| Strøm - Peak Pulse (8 / 20μs): | 175A |
| Strøm - Peak Pulse (10 / 1000μs): | 45A |
| Nåværende - Hold (Ih): | 150mA |
| kapasitans: | 47pF |
| Email: | [email protected] |
Beslektede deler til TISP7125F3P
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
TISP7125F3SL | Bourns Inc. | SURGE SUPP 100V BIDIR 3-SL | Forespørsel |
|
TISP7180F3DR | Bourns Inc. | SURGE SUPP 145V BIDIR 8-SOIC | Forespørsel |
|
TISP7125F3DR-S | Bourns Inc. | TRIPLE ELEMENT BIDIRECTIONAL TIS | Forespørsel |
|
TISP7125H3SL | Bourns Inc. | SURGE SUPP 100V BIDIR 3-SL | Forespørsel |
|
TISP7165H3SL | Bourns Inc. | SURGE SUPP 130V BIDIR 3-SL | Forespørsel |
|
TISP7125F3DR | Bourns Inc. | SURGE SUPP 100V BIDIR 8-SOIC | Forespørsel |
|
TISP7150F3DR | Bourns Inc. | SURGE SUPP 120V BIDIR 8-SOIC | Forespørsel |
|
TISP7180H3SL | Bourns Inc. | SURGE SUPP 145V BIDIR 3-SL | Forespørsel |
|
TISP7150F3P | Bourns Inc. | SURGE SUPP 120V BIDIR 8-DIP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog