Kjøpe TLK2711AIRCP med BYCHPS
Kjøp med garanti
TLK2711AIRCP
- Delenummer:
- TLK2711AIRCP
- Produsent:
- Beskrivelse:
- IC TXRX 1.6-2.7GBPS 64-HVQFP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14887 Pieces
- Dataark:
- TLK2711AIRCP.pdf
Introduksjon
BYCHIPS er strømprodusenten for TLK2711AIRCP, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for TLK2711AIRCP via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 2.3 V ~ 2.7 V |
|---|---|
| Type: | Transceiver |
| Leverandør Enhetspakke: | 64-HVQFP |
| Serie: | - |
| protokoll: | - |
| emballasje: | Tray |
| Pakke / tilfelle: | 64-VFQFP Exposed Pad |
| Andre navn: | 296-23681 TLK2711AIRCPG4 TLK2711AIRCPG4-ND |
| Driftstemperatur: | -40°C ~ 85°C |
| Antall drivere / mottakere: | 16/16 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | TLK2711AIRCP |
| Utvidet beskrivelse: | 16/16 Transceiver 64-HVQFP |
| duplex: | - |
| Beskrivelse: | IC TXRX 1.6-2.7GBPS 64-HVQFP |
| Datahastighet: | - |
| Email: | [email protected] |
Beslektede deler til TLK2711AIRCP
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
|
TLK2711IRCP | Texas Instruments | IC XCVR 1.6-2.7 GBPS 64-HVQFP | Forespørsel |
|
TLK2711HFG/EM | Texas Instruments | IC TXRX 1.6-2.5GBPS 68CFP | Forespørsel |
|
TLK2711IRCPG4 | Texas Instruments | IC XCVR 1.6-2.7 GBPS 64-HVQFP | Forespørsel |
|
TLK2711AIRCPR | Texas Instruments | IC TXRX 1.6-2.7GBPS 64-HVQFP | Forespørsel |
|
TLK2711JRGQE | Texas Instruments | IC XCVR 1.6-2.7 GBPS 80-BGA | Forespørsel |
|
TLK2701IRCPG4 | Texas Instruments | IC TRNSCVR 1.5-2.5GBPS 64HVQFP | Forespørsel |
|
TLK2711AJRZQE | Texas Instruments | IC TXRX 1.6-2.7GBPS 80-BGA | Forespørsel |
|
TLK2711JRZQE | Texas Instruments | IC GBPS TXRX 1.6-2.7GBPS 80-BGA | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers