Kjøpe PAS1220LA2R3106 med BYCHPS
Kjøp med garanti
PAS1220LA2R3106
- Delenummer:
- PAS1220LA2R3106
- Produsent:
- Taiyo Yuden
- Beskrivelse:
- CAP 10F 20% 2.3V THROUGH HOLE
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17711 Pieces
Introduksjon
BYCHIPS er strømprodusenten for PAS1220LA2R3106, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for PAS1220LA2R3106 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 2.3V |
|---|---|
| Toleranse: | ±20% |
| Avslutning: | Through Hole |
| Størrelse / Dimensjon: | 0.492" Dia (12.50mm) |
| Serie: | LA |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can |
| Andre navn: | 587-2018 |
| Driftstemperatur: | -25°C ~ 60°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | PAS1220LA2R3106 |
| Levetid @ Temp.: | - |
| Lead Spacing: | 0.197" (5.00mm) |
| Høyde - sittende (maks): | 0.866" (22.00mm) |
| Utvidet beskrivelse: | 10F ±20%(EDLC) Supercapacitor 2.3V Radial, Can 200 mOhm |
| ESR (ekvivalent serieresistens): | 200 mOhm |
| Beskrivelse: | CAP 10F 20% 2.3V THROUGH HOLE |
| kapasitans: | 10F |
| Email: | [email protected] |
Beslektede deler til PAS1220LA2R3106
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
PAS1220LA3R0905 | Taiyo Yuden | CAP 9F 20% 3V THROUGH HOLE | Forespørsel |
 |
105DER2R5SFN | Illinois Capacitor | CAP 1F -20%, +50% 2.5V T/H | Forespørsel |
|
PAS1235LA2R3226 | Taiyo Yuden | CAP 22F 20% 2.3V THROUGH HOLE | Forespørsel |
 |
EDLSD334H5R5C | Cornell Dubilier Electronics (CDE) | CAP 330MF 5.5V THROUGH HOLE | Forespørsel |
|
PAS1235LA3R0206 | Taiyo Yuden | CAP 20F 20% 3V THROUGH HOLE | Forespørsel |
 |
PAS1220LN2R7905 | Taiyo Yuden | CAP 9F 20% 2.7V THROUGH HOLE | Forespørsel |
 |
PAS0815LS2R5105 | Taiyo Yuden | CAP 1F 20% 2.5V THROUGH HOLE | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers