Kjøpe 01520903U med BYCHPS
Kjøp med garanti
01520903U
- Delenummer:
- 01520903U
- Produsent:
- Littelfuse
- Beskrivelse:
- COVER FOR MAXIHOLDER 152003.
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18351 Pieces
- Dataark:
- 01520903U.pdf
Introduksjon
BYCHIPS er strømprodusenten for 01520903U, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 01520903U via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | - |
|---|---|
| Andre navn: | 1520903U |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 9 Weeks |
| Produsentens varenummer: | 01520903U |
| For bruk med / relaterte produkter: | Fuseholder; Maxi® |
| Beskrivelse: | COVER FOR MAXIHOLDER 152003. |
| Tilbehørstype: | Cover |
| Email: | [email protected] |
Beslektede deler til 01520903U
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
01520900U | Littelfuse Inc. | DUST COVER FOR MAXIHOLDER 152001 | Forespørsel |
 |
01520001TXN940 | Littelfuse Inc. | FUSE HOLDER BLADE 32V 60A | Forespørsel |
 |
01520003TXN942 | Littelfuse Inc. | FUSE HLDR BLADE 32V 60A IN LINE | Forespørsel |
 |
01520900Z | Littelfuse Inc. | COVER FOR MAXI BLOK HOLDER | Forespørsel |
 |
01520007Z | Littelfuse Inc. | FUSEHOLDER COVER/O RING MAXI | Forespørsel |
|
01520009Z | Littelfuse Inc. | FUSE HOLDER BLADE 80A IN LINE | Forespørsel |
|
01520008Z | Littelfuse Inc. | FUSE HOLDER BLADE 80A IN LINE | Forespørsel |
|
01520903TXN | Littelfuse Inc. | COVER FOR MAXIHOLDER 152003. | Forespørsel |
 |
01520900H | Littelfuse Inc. | COVER FOR MAXIHOLDER 152001 | Forespørsel |
|
01520003TXN | Littelfuse Inc. | FUSE HLDR BLADE 32V 60A IN LINE | Forespørsel |
|
01520900TXN | Littelfuse Inc. | COVER FOR MAXIHOLDER 152001. | Forespørsel |
|
01520003TXN941 | Littelfuse Inc. | FUSE HLDR BLADE 32V 60A IN LINE | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers