Kjøpe 0318002.H med BYCHPS
Kjøp med garanti
0318002.H
- Delenummer:
- 0318002.H
- Produsent:
- Littelfuse
- Beskrivelse:
- FUSE GLASS 2A 250VAC 3AB 3AG
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15714 Pieces
- Dataark:
- 0318002.H.pdf
Introduksjon
BYCHIPS er strømprodusenten for 0318002.H, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 0318002.H via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier - DC: | - |
|---|---|
| Spenningsverdier - AC: | 250V |
| Størrelse / Dimensjon: | 0.275" Dia x 1.288" L (6.99mm x 32.72mm) |
| Serie: | 318 |
| Responstid: | Fast |
| emballasje: | Bulk |
| Pakke / tilfelle: | 3AB, 3AG, 1/4" x 1-1/4" (Axial) |
| Andre navn: | 0318002 0318002. 0318002.HXW 0318002.M 0318002.MXW 0318002H 0318002HXW 318 002 318 002(BULK) 318002 318002(BULK) F219 H318002 |
| Driftstemperatur: | - |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Smelting I²t: | 5.2 |
| Produsentens varenummer: | 0318002.H |
| Sikringstype: | Cartridge, Glass |
| Beskrivelse: | FUSE GLASS 2A 250VAC 3AB 3AG |
| DC kald motstand: | 0.07 Ohm |
| Nåværende vurdering: | 2A |
| Farge: | - |
| Brytekapasitet @ Nominell spenning: | 35A |
| godkjenninger: | CSA, UL |
| Email: | [email protected] |
Beslektede deler til 0318002.H
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers