Kjøpe 1130-560K med BYCHPS
Kjøp med garanti
1130-560K
- Delenummer:
- 1130-560K
- Produsent:
- Bourns, Inc.
- Beskrivelse:
- FIXED IND 56UH 9A 26 MOHM TH
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 13246 Pieces
- Dataark:
- 1130-560K.pdf
Introduksjon
BYCHIPS er strømprodusenten for 1130-560K, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 1130-560K via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Wirewound |
|---|---|
| Toleranse: | ±10% |
| Leverandør Enhetspakke: | - |
| Størrelse / Dimensjon: | 1.100" Dia (27.94mm) |
| skjerming: | Unshielded |
| Serie: | 1130 |
| rangeringer: | - |
| Q @ Freq: | - |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial |
| Andre navn: | M6304 |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale - Kjerne: | Ferrite |
| Produsentens varenummer: | 1130-560K |
| induktans: | 56µH |
| Høyde - sittende (maks): | 0.840" (21.34mm) |
| Frekvens - Test: | 1kHz |
| Frekvens - Selvresonans: | - |
| Utvidet beskrivelse: | 56µH Unshielded Wirewound Inductor 9A 26 mOhm Max Radial |
| Beskrivelse: | FIXED IND 56UH 9A 26 MOHM TH |
| DC-motstand (DCR): | 26 mOhm Max |
| Nåværende vurdering: | 9A |
| Nåværende - Metning: | - |
| Email: | [email protected] |
Beslektede deler til 1130-560K
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
1130-121K-RC | Bourns Inc. | FIXED IND 120UH 7.2A 46 MOHM TH | Forespørsel |
|
1130-182K | Bourns Inc. | FIXED IND 1.8MH 1.6A 705 MOHM TH | Forespørsel |
|
1130-1R0M-RC | Bourns Inc. | FIXED IND 1UH 21A 3 MOHM TH | Forespørsel |
|
1130-1R8M-RC | Bourns Inc. | FIXED IND 1.8UH 21A 3 MOHM TH | Forespørsel |
|
1130-561K-RC | Bourns Inc. | FIXED IND 560UH 4A 205 MOHM TH | Forespørsel |
|
1130-1R2M | Bourns Inc. | FIXED IND 1.2UH 21A 3 MOHM TH | Forespørsel |
|
1130-472K | Bourns Inc. | FIXED IND 4.7MH 1A 1.86 OHM TH | Forespørsel |
|
1130-1R5M-RC | Bourns Inc. | FIXED IND 1.5UH 21A 3 MOHM TH | Forespørsel |
|
1130-221K-RC | Bourns Inc. | FIXED IND 220UH 5.5A 80 MOHM TH | Forespørsel |
|
1130-390K | Bourns Inc. | FIXED IND 39UH 11.4A 22 MOHM TH | Forespørsel |
|
1130-4R7M | Bourns Inc. | FIXED IND 4.7UH 21A 3 MOHM TH | Forespørsel |
|
1130-821K-RC | Bourns Inc. | FIXED IND 820UH 2.8A 288 MOHM TH | Forespørsel |
|
1130-1R8M | Bourns Inc. | FIXED IND 1.8UH 21A 3 MOHM TH | Forespørsel |
|
1130-2R2M-RC | Bourns Inc. | FIXED IND 2.2UH 21A 3 MOHM TH | Forespørsel |
|
1130-4R7M-RC | Bourns Inc. | FIXED IND 4.7UH 21A 3 MOHM TH | Forespørsel |
|
1130-220K | Bourns Inc. | FIXED IND 22UH 13.5A 11 MOHM TH | Forespørsel |
|
1130-221K | Bourns Inc. | FIXED IND 220UH 5.5A 80 MOHM TH | Forespørsel |
|
1130-272K | Bourns Inc. | FIXED IND 2.7MH 1.3A 1.14 OHM TH | Forespørsel |
|
1130-120K-RC | Bourns Inc. | FIXED IND 12UH 13.5A 8 MOHM TH | Forespørsel |
|
1130-681K | Bourns Inc. | FIXED IND 680UH 2.8A 256 MOHM TH | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers